Board of Directors

Greg Caltabiano – President and CEO


Greg brings extensive knowledge of the mobile ecosystem and 30 years of operating experience in the US, China, Japan, Korea, and Europe. Most recently he was General Manager of the Ethernet Access Business at Broadcom Corporation following its successful acquisition of Teknovus, where he was CEO since 2006. In the process of building the company, Greg led Teknovus to a dominant position in the Ethernet Access market, particularly in China, the largest and fastest growing market. Previously he was President and COO of SOMA Networks, an early innovator in wireless broadband. Greg lived in Asia for nearly 14 years. He founded mobile industry pioneer Boston Technology/Comverse's business in Asia and built its Asian business to be nearly a quarter of Comverse's billion dollars of revenue. Greg has a BSEE Summa Cum Laude and Phi Beta Kappa from Princeton University and received his MBA from Stanford University where he was a FLAS Fellow. He also did postgraduate and Executive Education at the Inter-University Center in Tokyo and INSEAD in France.

Rich Redelfs – Foundation Capital


Rich joined Foundation Capital in 2004 after more than 20 years in networking and communications, amassing a combination of start-up entrepreneurial as well as large company intrapreneurial experience. Prior to joining the Foundation team, he was president and CEO of Atheros Communications, which he helped build into the leading provider of Wi-Fi wireless semiconductors. Rich received Frost & Sullivan's prestigious "Wireless LAN CEO of the Year" award in 2003. Previously, Rich was vice president and general manager of 3Com's Wireless and Home Connectivity Division. He spent more than ten years at 3com in various sales, marketing, and general management positions including vice president of Marketing and later acting general manager for the Mobile Communications Division. Prior to 3Com, Rich was chief operating officer of Polygon, a communications software start-up. Rich also serves on the board of Dust Network, Transphorm, Mobius, Prematics, and SiBeam. Rich holds a BSIE from Purdue University and an MBA from Harvard Business School.

Jean-Marc Patouillaud – Partech International


Jean-Marc is a co-managing partner of Partech International with Philippe Collombel, which he joined in 1996. Jean-Marc has a long track record of successful exits including IPOs with Lannet (GIAN), RadVision (RVSN), ALLOT (ALLT), Buongiorno (BGN.MI), and Alvarion (ALVR) and trade sales with Fluxus (acq. by British Telecom), Digitick (acq. by Vivendi), ISDNet (acq. by Cable and Wireless), Jungo (acq. by NTS), Jobpartners (acq. by ORCL) and Apogee (acq. by Colt). Prior to joining Partech, Jean-Marc was a partner at Finovelec, a Paris based venture capital firm and managed Genèse Investissements, the first French seed capital fund. He started his career as an engineer with Cegelec and worked in the Nuclear Power Plant division. He earned an MBA from HEC and an MS in Engineering from SUPELEC both in Paris.

Renaud Poulard – OMNES


Renaud began his career at the CEO (French Atomic Energy Commission) as a Research Engineer in lasters. he joined SAT in 1991 where he furthered his career as an Engineer and later Project Manager focusing in particular on telecoms networks and data transfer technologies. After the takover of SAT by Sagem in 1996, he bacame Head of Programming on optoelectronics equipment and later worked on a business development project on the IT security markets (PKI). In 2001 he was appointed Head of Programming on optoelectronics equipment and later worked on a business development project on the IT security markets (PKI). In 2001 he was appointed Head of Investments and later General Partner at SPEF eFund (Natexis group). He also sits on the board of Scality, 3D+, H2i, Oxatis et Confortvisuel. He graduated from the School of Optics in 1990 and holds an MBA from INSEAD.

Doug Spreng – Independent Board Member


Doug is a 40+-year high tech industry veteran who has held leadership positions with numerous high-profile semiconductor and equipment companies in the computer and communications market. Most recently, he was Chairman and CEO of Ubicom, Inc., a leading supplier of communication processors for wireless LAN applications. Before that, he was president and COO at AMCC, a publicly traded communications IC company. His position at AMCC resulted from an acquisition by AMCC of MMC Networks, a public fabless communications semiconductor company where he was president and CEO. Prior to his tenure at MMC Networks, he was executive vice president of the Client Access Business Unit at 3Com Corporation, where he was responsible for the company's $2 billion network interface card and modem businesses. During this period, he made many acquisitions of private technology companies to complement the 3Com product portfolio. He has also held executive positions at CellNet Data Systems and Hewlett-Packard Company. Doug holds a BS degree in Electrical Engineering from MIT and an MBA from Harvard University.